YOUR FUTURE RESPONSIBILITIES:
Advanced wafer-level integration of MEMS devices requires an in-depth understanding of each processing step on the performance of the devices. This thesis aims to investigate different aspects of wafer stacking via anodic bonding for the Next generation of Tire-Pressure Monitoring System (TPMS) sensors. In the course of this thesis, different methodology will be pursued to analyse the effect of anodic bonding on the performance of the sensors. Failure analysis, sample preparation (metallography/ cross-sectioning) for optical microscopy, SEM, wafer probing are the main experimental parts of these studies.
- Master student in material science, physics, microsystem technology or similar fields.
- Experience with sample preparation (metallography) procedure would be appreciated.
- Experience with clean room environment would be appreciated.
- Autonomous, well organized and enjoy working in a dynamic and multicultural team.
- Oral and written communication skills in English.
- Start date: from Feb 2021 (*Start date by arrangement)
- Duration: 6 Months.
- Payment: € 1.500 gross (38.5 Hours/Week).
- Additional Benefits: free coffee/milk, € 4.- food allowance per working day in restaurants, homeoffice, no coretime...
- State-of-the-art laboratories and equipment, including the opportunity to work in a cleanroom environment.
- An international scientific environment and contacts with our industrial network.
- Opportunity to work on a hot topic with industrial collaborations.
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